I tried the Micromark photoetch kit, with some good results. However, I have been unable to do fine detail with it (0.010" grids with 0.010" spacing, etc.). It uses a heat laminated photo emulsion - run it through a card laminator (supplied in the kit) to attach the photo resist to the metal. After exposure to UV light you develop it in a bath to remove the photo resist. I had trouble with this last part - a very thin invisible resist film remained over some parts of the plate after developing. This prevented etching, so some parts of the sheet would etch OK and others wouldn't etch at all. The kit has a small etching tank with a fish tank bubbler to keep the etchant circulating around the part, and this works pretty good. Here is a photo of some parts I made with this kit for a Cleveland class cruiser smoke pipe:
http://www.okieboat.com/Copyright%20ima ... 24%20C.jpg
I have ordered some spray-on photo resist, developing solution and a 300 watt UV lamp from Ocean State Electronics - parts of their Datak etching system. It is for printed circuit boards, but the etching is identical to metal foil photo etch. I haven't tried it yet.
The metal thickness must be less than the width of the finest detail you are etching - you can't etch 0.005" gaps in 0.010" thick metal. The etchant doesn't just cut straight through the metal like a saw. Inside the etch channel it cuts in ALL directions, vertical through the sheet and horizontal outward from the etch channel. The result is parts with a " ( " shaped edge cross section, but this is usually barely noticable. The etchant will undercut the photo resist pattern, taking away metal leaving an etch channel through the metal with a " ( ) " shaped cross section where the cut is widest in the middle of the thickness of the metal. If the detail is too fine the etchant will cut through from both edges of the thin part before it cuts through the thickness of the sheet. To avoid this use thinner metal.
To speed up the process and avoid "V" shaped cuts, etch from both sides of the sheet. This will require precise alignment of the photo resist patterns on both sides of the sheet. This isn't as difficult as it sounds - just put alignment targets ("+" marks) on the patterns for both sides and align them carefully with the metal sheet between them.
A friend with experience advised me to make the parts oversized because the etchant will undercut the photo resist. For very thin material (0.002" to 0.003" foil) you won't need to make parts oversize. For 0.005" sheet maybe 0.001" oversized on all edges will do, but for 0.010" you need to make parts oversize by about 0.002". So, if you want a 0.010" wide part using 0.010" thick metal, make the photo resist pattern 0.013" to 0.014" wide to allow 0.002" undercut on both sides.
You can heat the etchant to speed the process, but don't get it much more than 96F/37C (body temperature). Just don't use refrigerated etchant. DO NOT use hot etchant - the reaction may boil over and splatter or you might cook off the photo resist.
You MUST keep the etchant flowing over the work piece. The chemical process produces an inert precipitant that will pool on the sheet and block further etching. You can move the metal by hand, occasionally lifting it out of the bath to drain off the precipitant. It is best to have a vertical etch tank so gravity will pull the precipitant to the bottom of the tank. Still, you need to keep the etchant moving to dislodge the precipitant from the etch channels. Spraying the etchant onto a vertical sheet of metal is the best method, but you will need a non-metallic pump with a fairly high volume flow rate and a confining tank to recover the etchant.
Etch as little metal as possible - cover unused areas between parts with photoresist to reduce the actual etch area. This will prevent rapid depletion of the etchant and minimize precipitant buildup.
Some printers have darkness settings to control the amount of ink/toner that is applied. They normally default to a "medium" setting. In the printer control dialog change this to the darkest setting. This will produce the best photo resist patterns.
Expose the emulsion with the brightest light you can find - direct sunlight is good (if you live where it isn't cloudy all the time).
Be CERTAIN that the ink/toner side of your photo master is against the emulsion before exposure. If it is on the outside of the pattern film sheet the edges of the resist pattern will be "fuzzy" and the actual width of the etch part will be unpredictable.
I tried the Micromark photoetch kit, with some good results. However, I have been unable to do fine detail with it (0.010" grids with 0.010" spacing, etc.). It uses a heat laminated photo emulsion - run it through a card laminator (supplied in the kit) to attach the photo resist to the metal. After exposure to UV light you develop it in a bath to remove the photo resist. I had trouble with this last part - a very thin invisible resist film remained over some parts of the plate after developing. This prevented etching, so some parts of the sheet would etch OK and others wouldn't etch at all. The kit has a small etching tank with a fish tank bubbler to keep the etchant circulating around the part, and this works pretty good. Here is a photo of some parts I made with this kit for a Cleveland class cruiser smoke pipe:
http://www.okieboat.com/Copyright%20images/Smoke%20pipes%203%201024%20C.jpg
I have ordered some spray-on photo resist, developing solution and a 300 watt UV lamp from Ocean State Electronics - parts of their Datak etching system. It is for printed circuit boards, but the etching is identical to metal foil photo etch. I haven't tried it yet.
The metal thickness must be less than the width of the finest detail you are etching - you can't etch 0.005" gaps in 0.010" thick metal. The etchant doesn't just cut straight through the metal like a saw. Inside the etch channel it cuts in ALL directions, vertical through the sheet and horizontal outward from the etch channel. The result is parts with a " ( " shaped edge cross section, but this is usually barely noticable. The etchant will undercut the photo resist pattern, taking away metal leaving an etch channel through the metal with a " ( ) " shaped cross section where the cut is widest in the middle of the thickness of the metal. If the detail is too fine the etchant will cut through from both edges of the thin part before it cuts through the thickness of the sheet. To avoid this use thinner metal.
To speed up the process and avoid "V" shaped cuts, etch from both sides of the sheet. This will require precise alignment of the photo resist patterns on both sides of the sheet. This isn't as difficult as it sounds - just put alignment targets ("+" marks) on the patterns for both sides and align them carefully with the metal sheet between them.
A friend with experience advised me to make the parts oversized because the etchant will undercut the photo resist. For very thin material (0.002" to 0.003" foil) you won't need to make parts oversize. For 0.005" sheet maybe 0.001" oversized on all edges will do, but for 0.010" you need to make parts oversize by about 0.002". So, if you want a 0.010" wide part using 0.010" thick metal, make the photo resist pattern 0.013" to 0.014" wide to allow 0.002" undercut on both sides.
You can heat the etchant to speed the process, but don't get it much more than 96F/37C (body temperature). Just don't use refrigerated etchant. DO NOT use hot etchant - the reaction may boil over and splatter or you might cook off the photo resist.
You MUST keep the etchant flowing over the work piece. The chemical process produces an inert precipitant that will pool on the sheet and block further etching. You can move the metal by hand, occasionally lifting it out of the bath to drain off the precipitant. It is best to have a vertical etch tank so gravity will pull the precipitant to the bottom of the tank. Still, you need to keep the etchant moving to dislodge the precipitant from the etch channels. Spraying the etchant onto a vertical sheet of metal is the best method, but you will need a non-metallic pump with a fairly high volume flow rate and a confining tank to recover the etchant.
Etch as little metal as possible - cover unused areas between parts with photoresist to reduce the actual etch area. This will prevent rapid depletion of the etchant and minimize precipitant buildup.
Some printers have darkness settings to control the amount of ink/toner that is applied. They normally default to a "medium" setting. In the printer control dialog change this to the darkest setting. This will produce the best photo resist patterns.
Expose the emulsion with the brightest light you can find - direct sunlight is good (if you live where it isn't cloudy all the time).
Be CERTAIN that the ink/toner side of your photo master is against the emulsion before exposure. If it is on the outside of the pattern film sheet the edges of the resist pattern will be "fuzzy" and the actual width of the etch part will be unpredictable.